Ho-tae Jin

Title: Ho-tae Jin: Semiconductor Packaging Inventor

Introduction

Ho-tae Jin is an inventor based in Cheonan, South Korea, whose work focuses on semiconductor packaging and manufacturing processes. His patent portfolio includes 2 patents, including inventions related to double-faced semiconductor chips and ultraviolet cleaning of printed circuit boards. The patent information provided identifies Samsung Electronics Co., Ltd. as his company.

Latest Patents

Jin’s listed patents address different stages of semiconductor packaging and production.

- Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package. This invention describes a package built around a chip with integrated circuitry on both sides. It combines a lead-on-chip substrate with metal patterns on both sides, wire connections between the chip and substrate, sealing materials covering the assembly, and solder balls attached to the substrate. The design provides a method for fabricating the package.

- Semiconductor chip packaging system and a semiconductor chip packaging method using the same. This invention uses ultraviolet light to clean printed circuit boards before semiconductor packaging, rather than plasma gas. Because the ultraviolet cleaning process does not require a vacuum around the lamp, the cleaning chamber can be arranged in line with manufacturing equipment. This arrangement allows boards to proceed to fabrication soon after cleaning and helps reduce delays caused by waiting outside the equipment.

Career Highlights

The listed patents reflect Jin’s contributions to semiconductor packaging design and production workflows. One focuses on the structure and fabrication of a package for a double-faced chip, while the other addresses integrating board cleaning into a manufacturing line. The provided information associates his work with Samsung Electronics Co., Ltd.

Collaborations

The supplied information names Heui-seog Kim and Heui-Seong Kim as Jin’s coworkers. It does not specify their roles in the listed patents or describe particular collaborations.

Conclusion

Ho-tae Jin’s listed inventions address both semiconductor package construction and efficient preparation of printed circuit boards, highlighting complementary aspects of semiconductor manufacturing.