The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
May. 21, 2008
Jun-young Ko, Cheonan-si, KR;
Dae-sang Chan, Asan-si, KR;
Jae-yong Park, Cheonan-si, KR;
Heui-seog Kim, Cheonan-si, KR;
Wha-su Sin, Cheonan-Si, KR;
Jun-young Ko, Cheonan-si, KR;
Dae-sang Chan, Asan-si, KR;
Jae-yong Park, Cheonan-si, KR;
Heui-seog Kim, Cheonan-si, KR;
Wha-su Sin, Cheonan-Si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.