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Asan-si, South Korea

Dae-Sang Chan

USPTO Granted Patents = 7 (Patent Applications = 1)

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 20(Granted Patents)

Location History:

Cheonan-si, KR (2009)
Chungcheongnam-do, KR (2010)
Asan-si, KR (2010 - 2019)

Company Filing History:

7 out of 131,214

Samsung Electronics Co., Ltd.

Years Active: 2009-2019

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10410990 - Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus (2019-09-10),

2. 8956923 - Methods of fabricating semiconductor devices and underfill equipment for the same (2015-02-17),

3. 7863161 - Method of cutting a wafer (2011-01-04),

4. 7745932 - Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same (2010-06-29),

5. 7713788 - Method of manufacturing semiconductor package using redistribution substrate (2010-05-11),

6. 7696615 - Semiconductor device having pillar-shaped terminal (2010-04-13),

7. 7591714 - Wafer grinding and tape attaching apparatus and method (2009-09-22),

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