Dae-Sang Chan

Title: Dae-Sang Chan: Innovator in Semiconductor Technology

Introduction

Dae-Sang Chan is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative methods and apparatuses for bonding semiconductor chips, which are crucial for the advancement of electronic devices.

Latest Patents

Among his latest patents are a jig for bonding a semiconductor chip, an apparatus for bonding a semiconductor chip that includes the jig, and a method of bonding a semiconductor chip using the apparatus. The jig is designed to include a pressurizing portion and at least one opening. This pressurizing portion is configured to apply pressure to the upper surface of the semiconductor chip that is bonded to a package substrate via a bump and a flux using a laser. The opening, surrounded by the pressurizing portion, allows the laser to irradiate the bump and the flux while enabling vapor generated from the flux to be discharged, thus preventing contamination of the jig and maintaining the transmissivity of the laser.

Career Highlights

Dae-Sang Chan is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His innovative work has contributed to the development of advanced semiconductor devices, enhancing the performance and reliability of electronic products.

Collaborations

He has collaborated with notable coworkers, including Jun-Young Ko and Jae-Yong Park, who share his commitment to advancing semiconductor technology.

Conclusion

Dae-Sang Chan's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His inventions are paving the way for future advancements in electronic devices.