The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Aug. 22, 2008
Jun-young Ko, Chungcheongnam-do, KR;
Dae-sang Chan, Chungcheongnam-do, KR;
Heui-seog Kim, Chungcheongnam-do, KR;
Wha-su Sin, Chungcheongnam-do, KR;
Jae-yong Park, Chungcheongnam-do, KR;
Jun-Young Ko, Chungcheongnam-do, KR;
Dae-Sang Chan, Chungcheongnam-do, KR;
Heui-Seog Kim, Chungcheongnam-do, KR;
Wha-Su Sin, Chungcheongnam-do, KR;
Jae-Yong Park, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.