Chungcheongnam-do, South Korea

Wha-Su Sin

This inventor holds 5 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wha-Su Sin. Retrieved from https://idiyas.com/inventor/wha-su-sin-th9p5w9x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 40.0

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2007-2012

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5 patents (USPTO):Explore Patents

Title: Wha-Su Sin: Innovator in Semiconductor Technology

Introduction

Wha-Su Sin is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods and designs that enhance the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is titled "Semiconductor package and method of manufacturing the semiconductor package." This invention provides a semiconductor package that includes a mounting substrate with a bond finger and at least one semiconductor chip. The semiconductor chip features a bonding pad, and the package is designed with a first molding member that covers both the bond finger and the bonding pad. This first molding member contains an interconnection path that connects the bond finger to the bonding pad, which can be formed using a laser process. Additionally, a conductive element made from conductive nanoparticles or metal wires is integrated into the interconnection path, with a second molding member overlaying the first.

Another notable patent is the "Method of manufacturing semiconductor package using redistribution substrate." This method outlines a cost-effective approach to manufacturing semiconductor packages using a relatively thin redistribution substrate. The process involves attaching a semiconductor chip to the redistribution substrate, which is then connected to a printed circuit board. The method includes removing a support substrate, forming via holes to expose bond pads, and filling these holes with a conductive material. This innovative approach allows for the mounting of additional semiconductor chips on the redistribution substrate.

Career Highlights

Wha-Su Sin is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the development of advanced electronic devices.

Collaborations

Throughout his career, Wha-Su Sin has collaborated with notable colleagues, including Jong-Keun Jeon and Heui-Seog Kim. These collaborations have fostered an environment of innovation and have led to the successful development of several patents in the semiconductor field.

Conclusion

Wha-Su Sin is a distinguished inventor whose work in semiconductor technology has made a significant impact on the industry. His innovative patents and contributions to Samsung Electronics Co., Ltd. highlight his expertise and dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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