The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Jun. 30, 2005
Dae-sang Chun, Chungcheongnam-do, KR;
Jae-hong Kim, Chungcheongnam-do, KR;
Heui-seog Kim, Chungcheongnam-do, KR;
Jong-keun Jeon, Chungcheongnam-do, KR;
Wha-su Sin, Chungcheongnam-do, KR;
Dae-Sang Chun, Chungcheongnam-do, KR;
Jae-Hong Kim, Chungcheongnam-do, KR;
Heui-Seog Kim, Chungcheongnam-do, KR;
Jong-Keun Jeon, Chungcheongnam-do, KR;
Wha-Su Sin, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.