Guoan Wang

South Burlington, VT, United States of America

Guoan Wang

USPTO Granted Patents = 38 

Average Co-Inventor Count = 3.1

ph-index = 6

Forward Citations = 97(Granted Patents)


Location History:

  • Atlanta, GA (US) (2010)
  • Essex Junction, VT (US) (2012 - 2013)
  • Burlington, VT (US) (2012 - 2014)
  • South Burlington, VT (US) (2010 - 2015)
  • Lexington, SC (US) (2014 - 2015)
  • Columbia, SC (US) (2017 - 2020)
  • Irmo, SC (US) (2015 - 2023)

Company Filing History:


Years Active: 2010-2023

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38 patents (USPTO):

Title: Innovations by Guoan Wang: A Pioneer in High-Performance Interconnects and Antenna Structures

Introduction

Guoan Wang is a notable inventor based in South Burlington, VT, who has made significant contributions to the fields of interconnect design and antenna technology. With a remarkable portfolio of 36 patents, he is recognized for his innovative approaches to enhancing signal integrity and thermal management in communication systems.

Latest Patents

Among Guoan Wang's latest patents are two noteworthy inventions. The first is a "Method and design of high-performance interconnects with improved signal integrity," which introduces systems and methods for designing new interconnect structures. These designs incorporate interdigital trapezoidal tab structures, utilizing materials with higher permittivity or permeability to achieve superior signal integrity.

The second recent patent focuses on "Heat dissipating antenna structures." This invention describes an antenna assembly comprising an antenna and a heatsink designed to support radio communications while efficiently managing the heat generated during operation. The configuration allows for effective thermal dissipation by performing a convection operation between the antenna and a fluid.

Career Highlights

Guoan Wang has held prominent positions at esteemed organizations, notably IBM and the University of South Carolina. His work at IBM allowed him to delve into advanced research, where he could implement his ingenious inventions in real-world applications. At the University of South Carolina, he contributed to academic advancements and guided budding engineers in the field of communication technologies.

Collaborations

Throughout his career, Guoan Wang has collaborated with talented individuals including Essam Mina and Wayne Harvey Woods, Jr. These partnerships have facilitated innovation and propelled numerous projects toward successful outcomes.

Conclusion

Guoan Wang's extensive work in the innovation of high-performance interconnects and heat dissipating antenna structures demonstrates his pivotal role in advancing communication technologies. His contributions not only enhance signal integrity but also address critical thermal management challenges, reflecting the dynamic nature of engineering and invention.

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