The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Apr. 13, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Barbara S. Dewitt, Essex Junction, VT (US);
Essam Mina, South Burlington, VT (US);
BM Farid Rahman, Columbia, SC (US);
Guoan Wang, Columbia, SC (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 5/04 (2006.01); G06F 17/50 (2006.01); H01L 23/66 (2006.01); H01P 11/00 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01P 1/203 (2006.01); H01P 5/12 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H01P 5/04 (2013.01); G06F 17/5077 (2013.01); H01L 21/768 (2013.01); H01L 23/5222 (2013.01); H01L 23/66 (2013.01); H01P 1/203 (2013.01); H01P 3/081 (2013.01); H01P 3/082 (2013.01); H01P 5/12 (2013.01); H01P 11/003 (2013.01); H03H 7/38 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance.