Gunho Chang

Title: Gunho Chang: Semiconductor Packaging Inventor

Introduction

Gunho Chang is an inventor based in Suwon-si, South Korea. His work includes semiconductor packaging technologies, and he is associated with Samsung Electronics Ltd. Chang is credited with 6 patents.

Latest Patents

“Semiconductor Package with Reduced Adhesive Fillets” describes a package built around a base chip and a stack of semiconductor chips. The design uses through-vias to connect the chips and adhesive layers sized to be no wider than the corresponding chips. An encapsulant covers at least part of the chip stack, while the controlled adhesive width addresses the formation of adhesive fillets.

“Semiconductor Package” describes a chip stack with a logic chip positioned above it and outer terminals beneath it. The stack includes semiconductor chips with penetration vias, while a mold layer encloses the stack. The logic chip is wider than the chip stack.

Career Highlights

Chang’s listed patent work focuses on semiconductor packages, stacked chips, through-vias, adhesive layers, and molding structures. These technologies relate to the assembly and interconnection of components in semiconductor devices.

Collaborations

Chang’s listed coworkers include Dongjoo Choi and Jongpa Hong. The patent descriptions provided identify collaborative work on semiconductor packaging inventions.

Conclusion

Gunho Chang’s patent portfolio reflects a focus on semiconductor packaging designs that integrate stacked chips, electrical connections, and protective materials.