The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 19, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Gunho Chang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip including a first surface and an opposite second surface, second semiconductor chips vertically stacked on the first semiconductor chip, each of the second semiconductor chips including a third surface and an opposite fourth surface, and a molding layer on the first surface of the first semiconductor chip and at least partially surrounding the second semiconductor chips. The first surface of the first semiconductor chip is in direct contact with the fourth surface of a lowermost second semiconductor chip of the second semiconductor chips. The third surface of the lowermost second semiconductor chip of the second semiconductor chips is in direct contact with the fourth surface of an adjacent one of the second semiconductor chips. A width of each of the second semiconductor chips decreases in a direction from the third surface toward the fourth surface thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile