The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Mar. 18, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Gunho Chang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package may include a chip stack, a first semiconductor chip provided on a top surface of the chip stack, outer terminals provided on a bottom surface of the chip stack, and a mold layer provided on a bottom surface of the first semiconductor chip to enclose the chip stack. The chip stack may include a second semiconductor chip including first penetration vias, which are provided in second semiconductor chip and are exposed to an outside of the second semiconductor chip. The chip stack may include third semiconductor chips stacked on a top surface of the second semiconductor chip. Each of the third semiconductor chips may include second penetration vias, which are provided to penetrate the same and are exposed to an outside of the same. The first semiconductor chip may have a width larger than the chip stack, and the first semiconductor chip may include a logic chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile