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For the Inventor, By the Inventor

Hsinchu, Taiwan

Guan-Yu Chen

This inventor holds 28 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute, Au Optronics Corporation. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guan-Yu Chen. Retrieved from https://idiyas.com/inventor/guan-yu-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 28 

% Patents Active = 85.7

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 28(Granted Patents)


Location History:

  • Nantou County, TW (2016)
  • Chutung, TW (2017)
  • Hsin-Chu, TW (2014 - 2023)
  • Kaohsiung, TW (2016 - 2023)

Company Filing History:

goldMedal18 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal7 out of 9,312 
 
Industrial Technology Research Institute
 patents
bronzeMedal2 out of 4,577 
 
Au Optronics Corporation
 patents
4. 1 out of 1,308 
 
National Tsing Hua University
 patents

Years Active: 2014-2023

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Areas of Expertise:
Polarizer Module
Chip Package
Integrated Circuit
Light Emitting Device
Interconnect Structures
Wafer Level Package
Substrate Design
Bump Structure
Latch-Up Immunity
Oscillator Circuit
TFT-Free Devices
Supporting Materials
28 patents (USPTO):Explore Patents
1. 11803080 - Polarizer module and operation method thereof (2023-10-31),
2. 11775726 - Integrated circuit having latch-up immunity (2023-10-03),
3. 11502032 - Chip package and method of fabricating the same (2022-11-15),
4. 11416666 - Integrated circuit and method for forming the same (2022-08-16),
5. 11231613 - Display apparatus (2022-01-25),
6. 10872855 - Chip package and method of fabricating the same (2020-12-22),
7. 10366971 - Pre-applying supporting materials between bonded package components (2019-07-30),
8. 10141378 - Light emitting device free of TFT and chiplet (2018-11-27),
9. 10128195 - Substrate design with balanced metal and solder resist density (2018-11-13),
10. 10043774 - Integrated circuit packaging substrate, semiconductor package, and manufacturing method (2018-08-07),
11. 9966346 - Bump structure and method of forming same (2018-05-08),
12. 9899288 - Interconnect structures for wafer level package and methods of forming same (2018-02-20),
13. 9812405 - Semiconductor package and manufacturing method of the same (2017-11-07),
14. 9741959 - Light emitting device (2017-08-22),
15. 9704924 - Light emitting device (2017-07-11),

Title: Guan-Yu Chen: Pioneering Inventor from Hsinchu

Introduction: Guan-Yu Chen is a highly esteemed inventor hailing from the innovative city of Hsinchu, Taiwan. With a passion for creating groundbreaking technologies, he has made significant contributions to the field of inventions.

Latest Patents: Guan-Yu Chen holds several patents in various technological domains, showcasing his versatility and ingenuity in developing novel solutions to complex problems.

Career Highlights: Throughout his illustrious career, Guan-Yu Chen has been recognized for his exceptional creativity and forward-thinking approach to innovation. His inventions have not only revolutionized industries but have also improved the lives of many.

Collaborations: Guan-Yu Chen has collaborated with leading research institutions, universities, and companies to further his inventions and bring them to the market. His ability to work in diverse teams has led to the successful implementation of his groundbreaking ideas.

Conclusion: In conclusion, Guan-Yu Chen stands as a visionary inventor whose relentless pursuit of innovation has left an indelible mark on the world of inventions. His passion for creating transformative technologies continues to inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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