The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
May. 10, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Hao Chang, Xinpu Township, TW;
Tsung-Hsien Chiang, Hsinchu, TW;
Guan-Yu Chen, Hsinchu, TW;
Wei Sen Chang, Jinsha Township, TW;
Tin-Hao Kuo, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device package is provided. The device package includes a first die and a second die. A top surface of the first die is offset from a top surface of the second die in a direction that is parallel to a sidewall of the first die. A molding compound extends along sidewalls of the first die and the second die, where at least a portion of a top surface of the molding compound includes an inclined surface. A polymer layer contacts the top surface of the molding compound, the top surface of the first die, and the top surface of the second die. A top surface of the polymer layer is substantially level. A first conductive feature is in the polymer layer, where the first conductive feature is electrically connected to the first die.