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For the Inventor, By the Inventor

Jinsha, Taiwan

Wei Sen Chang

USPTO Granted Patents = 27 

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 103(Granted Patents)


Location History:

  • Tinsha Township, TW (2022)
  • Jinsha Township, TW (2012 - 2023)

Company Filing History:

goldMedal27 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2025

where 'Filed Patents' based on already Granted Patents

27 patents (USPTO):
1. 12334476 - Semiconductor device with discrete blocks (2025-06-17),
2. 12142582 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2024-11-12),
3. 11855045 - Semiconductor device with discrete blocks (2023-12-26),
4. 11769741 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2023-09-26),
5. 11476125 - Multi-die package with bridge layer (2022-10-18),
6. 11348884 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2022-05-31),
7. 11217562 - Semiconductor device with discrete blocks (2022-01-04),
8. 11101192 - Wafer level embedded heat spreader (2021-08-24),
9. 10861823 - Dual-sided integrated fan-out package (2020-12-08),
10. 10643861 - Methods for making multi-die package with bridge layer (2020-05-05),
11. 10510727 - Semiconductor device with discrete blocks (2019-12-17),
12. 10177073 - Wafer level embedded heat spreader (2019-01-08),
13. 10153249 - Dual-sided integrated fan-out package (2018-12-11),
14. 10008479 - Semiconductor device with discrete blocks (2018-06-26),
15. 9899288 - Interconnect structures for wafer level package and methods of forming same (2018-02-20),

Title: Innovations of Wei Sen Chang: A Pioneer in Semiconductor Technology

Introduction: Wei Sen Chang, based in Jinsha, Taiwan, is a renowned inventor with an impressive portfolio of 26 patents. His contributions to the field of semiconductor technology have been pivotal, particularly in the development of advanced interposer structures and semiconductor devices. This article explores his latest patents, career highlights, and collaborations.

Latest Patents: Wei Sen Chang's latest patents reflect his innovative spirit and expertise. One notable invention is the "Organic Interposer Including a Dual-Layer Inductor Structure and Methods of Forming the Same." This patent describes an organic interposer that features interconnect-level dielectric material layers embedding redistribution interconnect structures. It includes a dual-layer inductor structure, enhancing the efficiency and functionality of semiconductor devices.

Another significant patent is for a "Semiconductor Device with Discrete Blocks." This invention outlines a semiconductor device utilizing discrete connection blocks that incorporate through vias and integrated passive devices. Such innovations are particularly beneficial for Package on Package (PoP) applications, enabling more compact and efficient designs for electronic devices.

Career Highlights: Wei Sen Chang is currently employed by Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role has allowed him to engage in groundbreaking research and development, contributing to both the company’s growth and technological advancements in the sector.

Collaborations: Throughout his career, Wei Sen Chang has collaborated with notable colleagues, including Ching-Wen Hsiao and Chen-Shien Chen. These partnerships have fostered an environment of innovation and collective problem-solving, leading to the successful development of several patented technologies.

Conclusion: With 26 patents to his name, Wei Sen Chang exemplifies the spirit of innovation in semiconductor technology. His latest work continues to impact the industry, offering solutions that enhance device performance and functionality. As technology evolves, the contributions of inventors like Wei Sen Chang will undoubtedly shape the future of semiconductor advancements.

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