Taiwan Semiconductor Manufacturing Comp. Ltd.

Wei Sen Chang

Ching-Wen Hsiao

Chen-Shien Chen

Shou-Cheng Hu

Hao-Yi Tsai

Tin-Hao Kuo

Tsung-Hsien Chiang

Yen-Chang Hu

Kuo Lung Pan

Chung-Shi Liu

Ming-Da Cheng

Mirng-Ji Lii

Yu-Feng Chen

Chun-Hung Chen

Hong-Seng Shue

Wei-Han Chiang

Ching-Ho Cheng

Chen-Hua Douglas Yu

Chih-Hao Chang

Guan-Yu Chen

Chih-Wei Lin

Yu-Chih Huang

Hsiao Ching-Wen

A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.

Semiconductor device with discrete blocks

An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Organic interposer including a dual-layer inductor structure and methods of forming the same

A device is provided. The device includes a bridge layer over a first substrate. A first connector electrically connecting the bridge layer to the first substrate. A first die is coupled to the bridge layer and the first substrate, and a second die is coupled to the bridge layer.

Multi-die package with bridge layer

Disclosed herein is a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads.

Wafer level embedded heat spreader

A method for forming through vias comprises the steps of forming a dielectric layer over a package and forming an RDL over the dielectric layer, wherein forming the RDL includes the steps of forming a seed layer, forming a first patterned mask over the seed layer, and performing a first metal plating. The method further includes forming through vias on top of a first portion of the RDL, wherein forming the through vias includes forming a second patterned mask over the seed layer and the RDL, and performing a second metal plating. The method further includes attaching a chip to a second portion of the RDL, and encapsulating the chip and the through vias in an encapsulating material.

Dual-sided integrated fan-out package

A method is provided. The method includes attaching a bridge layer to a first substrate. The method also includes forming a first connector, the first connector electrically connecting the bridge layer to the first substrate. The method also includes coupling a first die to the bridge layer and the first substrate, and coupling a second die to the bridge layer.

Methods for making multi-die package with bridge layer

Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads.

A device package is provided. The device package includes a first die and a second die. A top surface of the first die is offset from a top surface of the second die in a direction that is parallel to a sidewall of the first die. A molding compound extends along sidewalls of the first die and the second die, where at least a portion of a top surface of the molding compound includes an inclined surface. A polymer layer contacts the top surface of the molding compound, the top surface of the first die, and the top surface of the second die. A top surface of the polymer layer is substantially level. A first conductive feature is in the polymer layer, where the first conductive feature is electrically connected to the first die.

Growing community of inventors

Jinsha, Taiwan

Wei Sen Chang