The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jul. 20, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Fang Lai, Hsinchu, TW;

Guan-Yu Chen, Kaohsiung, TW;

Yi-Feng Chang, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/00 (2020.01); G06F 30/392 (2020.01); H01L 21/768 (2006.01); G06F 30/398 (2020.01); G06F 30/20 (2020.01); H01L 27/118 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/20 (2020.01); G06F 30/398 (2020.01); H01L 21/768 (2013.01); H01L 27/14603 (2013.01); H01L 2027/11866 (2013.01);
Abstract

An integrated circuit includes a semiconductor substrate, devices, first tap regions, and second tap regions. The devices are over the semiconductor substrate. The first tap regions are over the semiconductor substrate along a first direction. The second tap regions are over the semiconductor substrate along the first direction. A first pitch between adjacent two of the first tap regions in the first direction is greater than a second pitch between adjacent two of the second tap regions in the first direction.


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