The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Mar. 04, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Fang Lai, Hsinchu, TW;

Guan-Yu Chen, Kaohsiung, TW;

Yi-Feng Chang, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/00 (2020.01); G06F 30/392 (2020.01); H01L 21/768 (2006.01); G06F 30/398 (2020.01); G06F 30/20 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/20 (2020.01); G06F 30/398 (2020.01); H01L 21/768 (2013.01);
Abstract

A method for forming an integrated circuit (IC) is provided. The method includes obtaining an IC design; generating a layout according to the IC design; calculating a score of a region in the layout based on voltage levels in the region; and fabricating a semiconductor device according to the layout when the score of the region in the layout is equal to or less than a threshold value.


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