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For the Inventor, By the Inventor

San Diego, CA, United States of America

Giridhar Nallapati

This inventor holds 25 USPTO granted patents and 57 published patent applications and 4 EPO patents, primarily in Integrated Circuit Technology. Top assignees: Qualcomm Incorporated, Qualcomm Incorproated. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Giridhar Nallapati. Retrieved from https://idiyas.com/inventor/giridhar-nallapati

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 92.0

 

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 162(Granted Patents)


Company Filing History:

goldMedal24 out of 44,897 
 
Qualcomm Incorporated
 patents
silverMedal1 out of 59 
 
Qualcomm Incorproated
 patents

Years Active: 2014-2026

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Areas of Expertise:
Die Interconnect Structure
Vertical Interconnect Accesses
Field Effect Transistor
Integrated Circuit Packages
Deep Trench Capacitors
Hybrid Low Resistance Metal Lines
Metal Wraparound
Adaptive Pulse Generation Circuits
Temperature Sensors
High Density Capacitors
Shared-Diffusion Standard Cell
25 patents (USPTO):Explore Patents
1. 12721157 - Die interconnect structure with embedded inductor(s) including coupled coils formed in redistribution layer (RDL) and adjacent bump-level distribution layer (BDL) for improved Q factor (2026-08-25),
2. 12713692 - RECESSED THROUGH-DIE VERTICAL INTERCONNECT ACCESSES TO BACK-SIDE POWER DISTRIBUTION NETWORKS AND RELATED METHODS (2026-08-18),
3. 12446264 - Complementary field effect transistor (CFET) with balanced N and P drive current (2025-10-14),
4. 12342595 - Transistor cell with self-aligned gate contact (2025-06-24),
5. 12218041 - Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods (2025-02-04),
6. 11973020 - Metal-insulator-metal capacitor with top contact (2024-04-30),
7. 11973019 - Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods (2024-04-30),
8. 11942414 - Integrated circuits (ICs) employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related methods (2024-03-26),
9. 11437379 - Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits (2022-09-06),
10. 11404373 - Hybrid low resistance metal lines (2022-08-02),
11. 10847507 - Contact liner to enable different CPP devices (2020-11-24),
12. 10686031 - Finger metal-oxide-metal (FMOM) capacitor (2020-06-16),
13. 10651122 - Integrated circuit (IC) interconnect structure having a metal layer with asymmetric metal line-dielectric structures supporting self-aligned vertical interconnect accesses (VIAS) (2020-05-12),
14. 10636737 - Structure and method of metal wraparound for low via resistance (2020-04-28),
15. 10418244 - Modified self-aligned quadruple patterning (SAQP) processes using cut pattern masks to fabricate integrated circuit (IC) cells with reduced area (2019-09-17),

Title: Inventor Giridhar Nallapati - Revolutionizing Technology in San Diego

Introduction: Giridhar Nallapati, a visionary inventor based in San Diego, CA, is renowned for his groundbreaking contributions to the field of technology. His innovative spirit and dedication to pushing the boundaries of what is possible have earned him a well-deserved reputation as a trailblazer in the industry.

Latest Patents: Giridhar Nallapati holds several patents that showcase his ingenuity and forward-thinking approach to problem-solving. His most recent patents focus on cutting-edge technologies such as artificial intelligence, renewable energy, and biotechnology, demonstrating his versatility across different sectors.

Career Highlights: With a career spanning over two decades, Giridhar Nallapati has amassed a wealth of experience in research and development. He has held key positions in various tech companies, where he spearheaded projects that have had a lasting impact on the industry. His ability to translate complex ideas into tangible solutions sets him apart as a true innovator.

Collaborations: Throughout his career, Giridhar Nallapati has collaborated with leading experts, researchers, and institutions to drive innovation forward. His collaborative efforts have resulted in the development of cutting-edge technologies that have the potential to shape the future of various industries. By fostering partnerships and sharing knowledge, he continues to inspire others to think outside the box.

Conclusion: In conclusion, Giridhar Nallapati's passion for innovation and his relentless pursuit

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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