The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Aug. 21, 2018
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Junjing Bao, San Diego, CA (US);
Jie Deng, San Diego, CA (US);
John Zhu, San Diego, CA (US);
Giridhar Nallapati, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/823475 (2013.01); H01L 23/5283 (2013.01); H01L 21/02167 (2013.01); H01L 21/76805 (2013.01); H01L 21/76807 (2013.01); H01L 21/76892 (2013.01); H01L 21/76897 (2013.01); H01L 21/823431 (2013.01); H01L 23/528 (2013.01); H01L 23/53209 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H01L 2221/1015 (2013.01);
Abstract
A semiconductor device includes a contact via and a metal interconnect on the contact via. The metal interconnect has a portion extending in a lengthwise direction that is wrapped around and in contact with a sidewall of the contact via. Along a widthwise direction, the metal interconnect does not contact the sidewall of the contact via.