Company Filing History:

6 out of 2,542

Cadence Design Systems, Inc.

Kla Tencor Corporation

patents

Years Active: 2007-2023

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11829077 - System and method for determining post bonding overlay (2023-11-28),

2. 11782411 - System and method for mitigating overlay distortion patterns caused by a wafer bonding tool (2023-10-10),

3. 10386829 - Systems and methods for controlling an etch process (2019-08-20),

4. 8141008 - Optical lithography correction process (2012-03-20),

5. 7882456 - Optical lithography correction process (2011-02-01),

6. 7784019 - Yield based retargeting for semiconductor design flow (2010-08-24),

7. 7600212 - Method of compensating photomask data for the effects of etch and lithography processes (2009-10-06),

8. 7588868 - Method and system for reducing the impact of across-wafer variations on critical dimension measurements (2009-09-15),

9. 7536670 - Method for verifying and choosing lithography model (2009-05-19),

10. 7444615 - Calibration on wafer sweet spots (2008-10-28),

11. 7392502 - Method for real time monitoring and verifying optical proximity correction model and method (2008-06-24),

12. 7246343 - Method for correcting position-dependent distortions in patterning of integrated circuits (2007-07-17),

13. 7224437 - Method for measuring and verifying stepper illumination (2007-05-29),

14. 7189481 - Characterizing flare of a projection lens (2007-03-13),

Title: Franz X Zach: Innovator in Wafer Metrology

Introduction

Franz X Zach is a prominent inventor based in Santa Clara, CA, known for his significant contributions to the field of wafer metrology. With a total of 14 patents to his name, he has made remarkable advancements in the technology used for measuring and analyzing wafer shapes.

Latest Patents

Among his latest patents is a system and method for determining post-bonding overlay. This innovative wafer shape metrology system includes a sub-system designed to perform stress-free shape measurements on both a first and second wafer, as well as on a post-bonding pair of these wafers. The system features a controller that receives these measurements and predicts overlay between features on the two wafers, providing feedback adjustments to process tools based on the predictions. Another notable patent addresses mitigating overlay distortion patterns caused by a wafer bonding tool. This system also utilizes a wafer shape metrology sub-system and a controller that analyzes measured distortion patterns to ensure that adjustments are made to maintain tolerance limits.

Career Highlights

Franz has worked with notable companies such as Cadence Design Systems, Inc. and Invarium, Inc. His experience in these organizations has allowed him to refine his expertise in wafer metrology and contribute to the development of cutting-edge technologies.

Collaborations

Throughout his career, Franz has collaborated with talented individuals, including Abdurrahman Sezginer and Gokhan Percin. These partnerships have further enhanced his innovative capabilities and have led to the successful development of various technologies.

Conclusion

Franz X Zach's work in wafer metrology has significantly impacted the industry, showcasing his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in wafer bonding and measurement, solidifying his reputation as a leading inventor in this field.

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