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For the Inventor, By the Inventor

Ontario, NY, United States of America

Eric J Meisenzahl

This inventor holds 24 USPTO granted patents and 2 EPO patents, primarily in CCD Image Sensors. Top assignees: Eastman-Kodak Company, Truesense Imaging, Inc., Semiconductor Components Industries, LLC. Active years: 1989-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric J Meisenzahl. Retrieved from https://idiyas.com/inventor/eric-j-meisenzahl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24

% Patents Active = 50.0

 

Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 34(Granted Patents)


Location History:

  • Rochester, NY (US) (1989)
  • Ontario, NY (US) (2007 - 2019)

Company Filing History:

goldMedal11 out of 21,605 
 
Eastman-Kodak Company
 patents
silverMedal10 out of 52 
 
Truesense Imaging, Inc.
 patents
bronzeMedal2 out of 3,735 
 
Semiconductor Components Industries, LLC
 patents
4. 1 out of 1,417 
 
Omnivision Technologies, Inc.
 patents

Years Active: 1989-2019

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Areas of Expertise:
CCD Image Sensors
Multi-Purpose Architecture
Image Sensor Sensitivity
Charge Management
Microlithographic Techniques
Residual Charge Draining
Optical Symmetry
Frequency Transforms
Readout Paths
Uniformity Testing
Angle Response
Dark Reference
24 patents (USPTO):Explore Patents
1. 10341590 - Methods and apparatus for a CCD image sensor (2019-07-02),
2. 9392736 - Methods for producing image sensors having multi-purpose architectures (2016-07-12),
3. 8800130 - Methods for producing image sensors having multi-purpose architecture (2014-08-12),
4. 8773563 - Multi-purpose architecture for CCD image sensors (2014-07-08),
5. 8760543 - Dark reference in CCD image sensors (2014-06-24),
6. 8728722 - Stitching methods using multiple microlithographic expose tools (2014-05-20),
7. 8728713 - Stitching methods using multiple microlithographic expose tools (2014-05-20),
8. 8605187 - CCD image sensors having multiple lateral overflow drain regions for a horizontal shift register (2013-12-10),
9. 8415813 - Identification of dies on a semiconductor wafer (2013-04-09),
10. 8415175 - Identification of dies on a semiconductor wafer (2013-04-09),
11. 8411189 - Multi-purpose architecture for CCD image sensors (2013-04-02),
12. 8350952 - Image sensors with improved angle response (2013-01-08),
13. 8134630 - System and method for draining residual charge from charge-coupled device (CCD) shift registers in image sensors having reset drains (2012-03-13),
14. 7948534 - Charge-coupled device image sensor with vertical binning of same-color pixels (2011-05-24),
15. 7893981 - Image sensor with variable resolution and sensitivity (2011-02-22),

Title: The Inventor Profile of Eric J Meisenzahl

Introduction: Eric J Meisenzahl is a renowned inventor based in Ontario, NY (US) known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Eric J Meisenzahl holds several patents in diverse areas such as technology, healthcare, and consumer products, showcasing his versatility and creativity in inventing novel solutions.

Career Highlights: With a career spanning over two decades, Eric J Meisenzahl has established himself as a prolific inventor with a keen eye for identifying gaps in the market and developing unique inventions to address them. His dedication to innovation has led to the successful commercialization of several of his patented products.

Collaborations: Throughout his career, Eric J Meisenzahl has collaborated with leading companies, research institutions, and universities to further develop and refine his inventions. These partnerships have been instrumental in bringing his ideas to life and making a positive impact on society.

Conclusion: Eric J Meisenzahl's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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