The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Jun. 15, 2011
Shen Wang, Webster, NY (US);
Robert P. Fabinski, Rochester, NY (US);
James E. Doran, Ontario, NY (US);
Laurel J. Pace, Rochester, NY (US);
Eric J. Meisenzahl, Ontario, NY (US);
Shen Wang, Webster, NY (US);
Robert P. Fabinski, Rochester, NY (US);
James E. Doran, Ontario, NY (US);
Laurel J. Pace, Rochester, NY (US);
Eric J. Meisenzahl, Ontario, NY (US);
Truesense Imaging, Inc., Rochester, NY (US);
Abstract
A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.