Santa Clara, CA, United States of America

Eric A Sanjuan

USPTO Granted Patents = 11 

 

 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • San Jose, CA (US) (2013 - 2018)
  • Santa Clara, CA (US) (2017 - 2019)

Company Filing History:


Years Active: 2013-2019

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11 patents (USPTO):Explore Patents

Title: Inventor Eric A. Sanjuan: Innovating Die Package Technology

Introduction

Eric A. Sanjuan, a prominent inventor based in Santa Clara, CA, has made significant contributions to the field of die package technology. With a portfolio of 11 patents, Sanjuan has demonstrated his expertise and commitment to innovation, particularly in developing techniques that enhance the performance and efficiency of electronic components.

Latest Patents

Among his latest inventions, Sanjuan has developed two notable patents. The first is titled "Mixed Impedance Leads for Die Packages and Method of Making the Same." This invention introduces a die package featuring mixed impedance leads; one lead contains a metal core surrounded by a dielectric layer, while the second lead has a different metal core and dielectric layer, with varying dielectric thicknesses to achieve distinct impedances. The method of manufacturing these leads involves connecting the die package to substrate connection pads with wirebonds that differ in their metal core attributes and subsequent dielectric processing.

The second patent focuses on "Coated Bond Wires for Die Packages and Methods of Manufacturing Said Coated Bond Wires." This innovation outlines a bond wire that includes a metal core and a dielectric layer, enhanced with one or more vapor barrier coatings. It aims to improve the reliability and performance of the bond wire within die packages, addressing challenges associated with environmental exposure.

Career Highlights

Sanjuan's professional journey includes significant tenures at leading companies in the communications and technology sectors. He has worked with Rosenberger Hochfrequenztechnik GmbH & Co. KG, providing him a platform to further develop his skills in high-frequency technology. Additionally, he has been associated with Bridgewave Communications, Inc., a firm specializing in advanced wireless technology solutions.

Collaborations

Throughout his career, Eric Sanjuan has collaborated with talented professionals, including his co-worker Sean S. Cahill. These collaborations have provided an environment conducive to innovation and contributed to the successful development of cutting-edge technologies in the electronic domain.

Conclusion

Eric A. Sanjuan exemplifies the spirit of innovation in the technology sector. His extensive patent portfolio reflects his dedication to enhancing die package technology and his capability to drive advancements within the industry. With his continuous contributions and collaborations, Sanjuan remains a significant figure in the field of electronics, paving the way for future innovations.

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