The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Jul. 02, 2014
Applicant:

Rosenberger Hochfrequenztechnik Gmbh & Co. KG, Fridolfing, DE;

Inventors:

Sean S. Cahill, Santa Clara, CA (US);

Eric A. Sanjuan, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01L 23/373 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01); H01L 23/467 (2013.01); H01L 23/66 (2013.01); H01L 24/09 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 25/167 (2013.01); H01S 5/02248 (2013.01); H01S 5/02276 (2013.01); H01S 5/02469 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/2784 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A die interconnect system having a plurality of connection pads, a heat generating element thermally isolated from the die, one or more leads extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, and an outer metal layer attached to ground, wherein one or more leads are exposed to ambient conditions and/or are convectively or contact cooled for at least a portion of their length to minimize heat transfer from the heat generating element to the die.


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