The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
May. 31, 2012
Applicants:
Eric A. Sanjuan, San Jose, CA (US);
Sean S. Cahill, Palo Alto, CA (US);
Inventors:
Eric A. Sanjuan, San Jose, CA (US);
Sean S. Cahill, Palo Alto, CA (US);
Assignee:
Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, DE;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/66 (2006.01); H01L 23/047 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/047 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01084 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19033 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/30111 (2013.01); H05K 1/0243 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49018 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49144 (2015.01);
Abstract
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.