The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jul. 02, 2014
Applicant:
Rosenberger Hochfrequenztechnik Gmbh & Co. KG, Fridolfing, DE;
Inventors:
Sean S. Cahill, Santa Clara, CA (US);
Eric A. Sanjuan, Santa Clara, CA (US);
Assignee:
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG, Fridolfing, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/10 (2006.01); H01Q 23/00 (2006.01); H01L 23/367 (2006.01); H01Q 1/28 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/367 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01Q 1/283 (2013.01); H01Q 23/00 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A die interconnect system having a first die with a plurality of connection pads, and a ribbon lead extending from the first die, the ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground.