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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711479 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

Jul. 02, 2014

Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same

Applicant:

Rosenberger Hochfrequenztechnik Gmbh & Co. KG, Fridolfing, DE;

Inventors:

Sean S. Cahill, Santa Clara, CA (US);

Eric A. Sanjuan, Santa Clara, CA (US);

Assignee:

Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, DE;

Attorneys:

DeLio, Peterson & Curcio, LLC

Robert Curcio

Primary Examiner:

Jami M Valentine

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/568 (2013.01); H01L 23/4952 (2013.01); H01L 23/64 (2013.01); H01L 24/49 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/85001 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85931 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract

A die package having a plurality of connection pads, a plurality of wire leads having metal cores with a defined core diameter, and a dielectric layer surrounding the metal cores having a defined dielectric thickness, at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core, and at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core. Further, the present invention relates to a method for manufacturing a substrate less die package.

Find Patent Forward Citations

Cahill, Sean. (2017). Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same (U.S. Patent No. 9711479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9711479

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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