The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Jul. 02, 2014
Applicant:
Rosenberger Hochfrequenztechnik Gmbh & Co. KG, Fridolfing, DE;
Inventors:
Sean S. Cahill, Santa Clara, CA (US);
Eric A. Sanjuan, Santa Clara, CA (US);
Assignee:
Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4821 (2013.01); H01L 21/4846 (2013.01); H01L 23/49506 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/64 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 23/50 (2013.01); H01L 24/45 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/4555 (2013.01); H01L 2224/4556 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45541 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/8593 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85931 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2224/85947 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30111 (2013.01);
Abstract
A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.