The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Jul. 02, 2014
Applicant:
Rosenberger Hochfrequenztechnik Gmbh & Co. KG, Fridolfing, DE;
Inventors:
Sean S. Cahill, Santa Clara, CA (US);
Eric A. Sanjuan, Santa Clara, CA (US);
Assignee:
Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/4952 (2013.01); H01L 23/49861 (2013.01); H01L 23/50 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 24/45 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6638 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/4556 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85931 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06537 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk.