Eiji Nagata

Title: Innovator Eiji Nagata: Advancing Copper Technology through Patented Inventions

Introduction

Eiji Nagata is a notable inventor based in Yokohama, Japan, who has contributed significantly to the field of materials engineering. With a total of seven patents to his name, he has made substantial advancements in the technology of electrolytic copper foils and metal composite films, enhancing the performance and reliability of electronic components.

Latest Patents

Eiji Nagata’s latest innovations include a resin composite electrolytic copper foil and a metal composite film geared towards improving heat resistance and adhesion strength. The resin composite electrolytic copper foil addresses heat resistance and plate adhesion strength during the desmear treatment process. The invention employs a roughened surface on the electrolytic copper foil with specified surface roughness and lightness value, facilitating better adhesion when coated with a specific resin composition.

Additionally, the metal composite film that he developed showcases excellent heat resistance and is suitable for high-density flexible printed circuit boards. This invention integrates insulating films and thermoplastic polyimide layers with metal layers achieved through electroless and electrolytic plating processes, ensuring superior adhesion and performance even with fine wiring.

Career Highlights

Over his career, Nagata has been associated with leading companies such as Pi R&D Co., Ltd. and Matsushita Electric Industrial Co., Ltd. His work in these organizations has been pivotal in advancing technologies related to copper and composite materials. His expertise and inventions have led to improved manufacturing techniques in electronic components, driving innovation in the industry.

Collaborations

Eiji Nagata has collaborated with prominent professionals including Mitsuru Nozaki and Masashi Yano. Their joint efforts have further propelled advancements in material sciences, particularly in developing technologies that enhance product functionality and performance in electronics.

Conclusion

In conclusion, Eiji Nagata stands out as a significant figure in the field of patents and innovations related to copper technologies. His latest patents are not only a testament to his inventive spirit but also highlight the ongoing progress in electronic component manufacturing. With each patent, he contributes to the future of flexible electronics, making waves in the industry with his groundbreaking work.