The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Aug. 19, 2016
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Pi R&d Co., Ltd., Kanagawa, JP;
Mitsuru Nozaki, Tokyo, JP;
Akihiro Nomoto, Tokyo, JP;
Norikatsu Akiyama, Tokyo, JP;
Eiji Nagata, Kanagawa, JP;
Masashi Yano, Kanagawa, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
PI R&D CO., LTD., Kanagawa, JP;
Abstract
The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.