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Kanagawa, Japan

Pi R&d Co., Ltd.

USPTO Granted Patents = 20

EPO Patents = 10

Forward Citations = 160

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37 inventors (with patents filed for the assignee):

Toshiyuki Goshima (8 out of 8 patents)

Maw Soe Win (8 out of 8 patents)

Hiroshi Itatani (7 out of 9 patents)

4. Shunichi Matsumoto (5 out of 58 patents)

5. Sigemasa Segawa (5 out of 5 patents)

6. Eiji Nagata (4 out of 7 patents)

7. Mitsuru Nozaki (3 out of 9 patents)

8. Eika Kyo (3 out of 3 patents)

9. Masashi Yano (3 out of 32 patents)

10. Hiroshi Nakagawa (2 out of 16 patents)

11. Masahiro Aoyagi (2 out of 18 patents)

12. Katsuya Kikuchi (2 out of 15 patents)

13. Takaki Mori (2 out of 2 patents)

14. Shintaro Nakajima (2 out of 2 patents)

15. Shuzo Waki (2 out of 2 patents)

20 patents: Sort by Forward Citations

1. 11569508 - Binder resin for lithium secondary battery electrode, electrode for lithium secondary battery, and lithium secondary battery (2023-01-31),

2. 9949371 - Resin composite electrolytic copper foil, copper clad laminate and printed wiring board (2018-04-17),

3. 9780376 - Conductive agent for battery electrode, electrode containing the same, and battery (2017-10-03),

4. 9780375 - Conductive agent for battery electrode, electrode containing the same, and battery (2017-10-03),

5. 9287424 - Polyimide resin composition for use in forming reverse reflecting layer in photovoltaic cell and method of forming reverse reflecting layer in photovoltaic cell used therewith (2016-03-15),

6. 8987376 - Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices (2015-03-24),

7. 8859170 - Photosensitive modified polyimide resin composition and use thereof (2014-10-14),

8. 8779085 - Modified polyimide and method for producing modified polyimide (2014-07-15),

9. 8771496 - Process for producing metal composite film (2014-07-08),

10. 8372257 - Electrodeposition coating material and electrodeposition method (2013-02-12),

11. 8349537 - Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof (2013-01-08),

12. 7989081 - Resin composite copper foil, printed wiring board, and production processes thereof (2011-08-02),

13. 7892651 - Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate (2011-02-22),

14. 7648815 - Negative photosensitive polyimide composition and method for forming image the same (2010-01-19),

15. 7323348 - Superconducting integrated circuit and method for fabrication thereof (2008-01-29),

PI R&D CO., LTD. is a leading research and development company specializing in innovative technologies. They focus on providing cutting-edge solutions in various industries such as aerospace, automotive, electronics, and medical. With a team of highly skilled scientists and engineers, PI R&D is dedicated to delivering exceptional products and services that meet the evolving needs of their clients. Visit their website for more information.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

20 Patents

#92 in Kanagawa

#2,886 in Japan

#30,364 in the World

Kanagawa, Japan

Pi R&d Co., Ltd.

Forward Citations = 160

37 inventors:

Toshiyuki Goshima (8 out of 8 patents)

Maw Soe Win (8 out of 8 patents)

Hiroshi Itatani (7 out of 9 patents)

4. Shunichi Matsumoto (5 out of 58 patents)

5. Sigemasa Segawa (5 out of 5 patents)

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