The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Apr. 30, 2010
Toshiyuki Goshima, Yokohama, JP;
Maw Soe Win, Yokohama, JP;
Sigemasa Segawa, Yokohama, JP;
Eika Kyo, Yokohama, JP;
Toshiyuki Goshima, Yokohama, JP;
Maw Soe Win, Yokohama, JP;
Sigemasa Segawa, Yokohama, JP;
Eika Kyo, Yokohama, JP;
PI R&D Co., Ltd., Yokohama-Shi, JP;
Abstract
Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.