The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Sep. 13, 2005
Takabumi Omori, Tokyo, JP;
Mitsuru Nozaki, Tokyo, JP;
Eiji Nagata, Yokohama, JP;
Masashi Yano, Yokohama, JP;
Takabumi Omori, Tokyo, JP;
Mitsuru Nozaki, Tokyo, JP;
Eiji Nagata, Yokohama, JP;
Masashi Yano, Yokohama, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
PI R&D Co., Ltd., Kanagawa-ken, JP;
Abstract
A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.