The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jan. 25, 2007
Mitsuru Nozaki, Tokyo, JP;
Morio Gaku, Tokyo, JP;
Yasuo Tanaka, Tokyo, JP;
Eiji Nagata, Yokohama, JP;
Yasuo Kikuchi, Yokohama, JP;
Masashi Yano, Yokohama, JP;
Mitsuru Nozaki, Tokyo, JP;
Morio Gaku, Tokyo, JP;
Yasuo Tanaka, Tokyo, JP;
Eiji Nagata, Yokohama, JP;
Yasuo Kikuchi, Yokohama, JP;
Masashi Yano, Yokohama, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
PI R&D Co., Ltd., Kanagawa-ken, JP;
Abstract
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.