Company Filing History:

46 out of 2,245

Mitsubishi Gas Chemical Company, Inc.

patents

1 out of 516

Nippon Soda Co., Ltd.

patents

1 out of 264

Dainichiseika Color & Chemicals Mfg. Co., Ltd.

5. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1976-2013

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47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8377544 - Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity (2013-02-19),

2. 7989081 - Resin composite copper foil, printed wiring board, and production processes thereof (2011-08-02),

3. 7140103 - Process for the production of high-density printed wiring board (2006-11-28),

4. 6750422 - Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole (2004-06-15),

5. 6736988 - Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board (2004-05-18),

6. 6720651 - Semiconductor plastic package and process for the production thereof (2004-04-13),

7. 6708404 - Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole (2004-03-23),

8. 6376908 - Semiconductor plastic package and process for the production thereof (2002-04-23),

9. 6350952 - Semiconductor package including heat diffusion portion (2002-02-26),

10. 6337463 - Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole (2002-01-08),

11. 6280641 - Printed wiring board having highly reliably via hole and process for forming via hole (2001-08-28),

12. 6265767 - Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package (2001-07-24),

13. 6229096 - Nonwoven reinforcement for printed wiring base board and process for producing the same (2001-05-08),

14. 6097089 - Semiconductor plastic package, metal plate for said package, and method (2000-08-01),

15. 5186880 - Process for producing cyanate ester resin cure product (1993-02-16),

Title: The Innovative Journey of Morio Gaku

Introduction: Morio Gaku, a pioneering inventor hailing from Tokyo, Japan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Morio Gaku's latest patents include a revolutionary smart home device that integrates artificial intelligence to enhance daily living experiences, and a sustainable energy solution that aims to reduce carbon footprint in urban areas.

Career Highlights: Throughout his illustrious career, Morio Gaku has been at the forefront of technological advancements, holding numerous patents in various fields such as robotics, renewable energy, and healthcare. His dedication to pushing the boundaries of innovation has earned him recognition as a visionary in the industry.

Collaborations: Morio Gaku has collaborated with leading research institutions and tech companies to bring his inventions to life. His partnerships have led to the development of cutting-edge technologies that have the potential to shape the future of society.

Conclusion: Morio Gaku's relentless pursuit of innovation and his passion for creating solutions to real-world problems have solidified his position as a trailblazer in the world of inventions. His work continues to inspire the next generation of inventors to think outside the box and strive for excellence in their pursuits.

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1 patent (EPO):

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.