Mitsubishi Gas Chemical Company, Inc.

Other

Nippon Soda Co., Ltd.

Dainichiseika Color & Chemicals Mfg. Co., Ltd.

Pi R&d Co., Ltd.

Morio Gaku

Nobuyuki Ikeguchi

Hidenori Kimbara

Yasuo Tanaka

Hidenori Kinbara

Yoshihiro Kato

Mitsuru Nozaki

Satoshi Ayano

Kazuhiro Suzuki

Toshihiko Kobayashi

Yasunari Osaki

Kazuyuki Nakamichi

Masakazu Motegi

Kenzi Ishii

Jun Yokoi

Toru Notomi

Nobuyuki Yamane

Masashi Yano

Kazuyuki Ohya

Keiichi Iwata

Kazuo Noguchi

Hiroo Muramoto

Eiji Nagata

Takehiko Moriya

Norio Nagai

Koichi Nakano

Takamasa Nakai

Katsuji Komatsu

Mineaki Tanigaichi

Tamemaru Esaki

Hidenori Kimpara

Mitsuo Ejiri

Susumu Yoshimura

Taro Yoshida

Naohito Yoshimura

Shunichi Sato

Ken-ichi Shimizu

Masaharu Kurata

Susumu Motoori

Mitsuo Eziri

Yukiya Masuda

Shiro Higashida

Touru Nohtomi

Nobuyuk Ikeguchi

Sadao Masaki

Toshiyuki Takao

Akira Katata

Kanzi Ishikawa

Hiroki Aoto

Syunichi Nagai

Akira Yahagi

Takaaki Osanai

Fumio Sato

Yasuo Kikuchi

Kenji Saimen

Koichi Ishizuka

Yousuke Funamoto

A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 &#x3bc;m, a weight of 15 to 165 g/mand a gas permeability of 1 to 20 cm/cm/sec. with a thermosetting resin composition and drying it.

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Resin composite copper foil, printed wiring board, and production processes thereof

Process for producing a high-density printed wiring board, comprising:

Process for the production of high-density printed wiring board

A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900&deg; C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900&deg; C. and a bond energy of at least 300 KJ/mol.

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

A copper-clad board suitable for making a hole with a carbon dioxide gas laser, which copper-clad board is obtained by disposing a double-side-treated copper foil provided with a metallic-treatment layer having a high absorption rate of a carbon dioxide gas laser energy on at least one surface, at least on an outer layer of a thermosetting resin composition layer such that the metallic-treatment layer is formed on a shiny surface of the copper foil which shiny surface is to be a surface layer, and laminate-forming the double-side-treated copper foil and the thermosetting resin composition layer under heat and pressure, to make an alloy of the metallic-treatment layer and the copper by the above heating, a method of making hole in the above copper-clad board and a printed wiring board comprising the above copper-clad board.

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

Semiconductor plastic package and process for the production thereof

A method of making a high-density copper-clad multi-layered printed wiring board having a reliable through hole including providing a stacked assembly including three copper foil layers and at least two resin layers; providing an auxiliary material on a top surface of the stacked assembly and providing a backup sheet on a bottom surface of the stacked assembly to form an assembly; subjecting the top surface of the assembly to pulsed oscillation from a carbon dioxide laser to form at least one through-hole to produce a pulsed assembly; reducing the thickness of the front and reverse copper foil layers and simultaneously with reducing, removing copper foil burrs, to produce a cleaned assembly; and plating the cleaned assembly with copper to produce the high-density copper-clad multi-layered printed wiring board.

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

Semiconductor package including heat diffusion portion

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900&deg; C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

Printed wiring board having highly reliably via hole and process for forming via hole

There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290&deg; C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290&deg; C. or higher and is in the form of a film having holes including at least 5 holes/mm,each with an area of opening of 400 to 1000 &mgr;m,(component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

Nonwoven reinforcement for printed wiring base board and process for producing the same

Semiconductor plastic package, metal plate for said package, and method

The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.

Process for producing cyanate ester resin cure product

Growing community of inventors

Tokyo, Japan

Morio Gaku