The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Feb. 25, 2011
Toshiyuki Goshima, Yokohama, JP;
Sigemasa Segawa, Yokohama, JP;
Maw Soe Win, Yokohama, JP;
Junichi Yamashita, Tokyo, JP;
Ken Takanashi, Tokyo, JP;
Toshiyuki Goshima, Yokohama, JP;
Sigemasa Segawa, Yokohama, JP;
Maw Soe Win, Yokohama, JP;
Junichi Yamashita, Tokyo, JP;
Ken Takanashi, Tokyo, JP;
PI R&D Co., Ltd., Kanagawa, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.