Xinzhu, Taiwan

Ebin Liao


Average Co-Inventor Count = 5.5

ph-index = 5

Forward Citations = 37(Granted Patents)


Location History:

  • Taichung, TW (2013 - 2015)
  • Xinzhu, TW (2013 - 2023)
  • Hsin-Chu, TW (2017 - 2024)

Company Filing History:


Years Active: 2013-2024

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20 patents (USPTO):

Title: Innovations by Ebin Liao in Semiconductor Technology

Introduction

Ebin Liao, based in Xinzhu, Taiwan, is a prominent inventor known for his significant contributions to the field of semiconductor technology. With a total of 20 patents to his name, his work encapsulates innovative methods that aim to enhance the efficiency and effectiveness of semiconductor components.

Latest Patents

Among Ebin's most recent patents, two stand out due to their advanced methodologies. The first patent, titled "Package structure and method of forming the same," discloses a comprehensive method of forming a package structure. This method includes several key steps: bonding a die to a wafer, performing a thinning process on the die which results in a first total thickness variation (TTV), and forming a dielectric layer on the wafer to cover both the sidewalls and the top surface of the die. The process further elaborates on a first and second removal process aimed at optimizing the thickness of the dielectric layer in relation to the TTV.

The second notable patent is for a "Semiconductor component having through-silicon vias." This invention details a semiconductor component featuring a substrate with an opening, which is lined with a first dielectric liner. The innovation focuses on controlling the thickness and ratio of dielectric liners to maximize the component's performance.

Career Highlights

Ebin Liao is actively employed at Taiwan Semiconductor Manufacturing Company, Limited, a leading entity in the semiconductor industry. His work is crucial in pushing the boundaries of semiconductor fabrication and design, allowing for more efficient and reliable electronic devices.

Collaborations

In his inventive journey, Ebin collaborates with esteemed colleagues such as Wen-Chih Chiou and Tsang-Jiuh Wu. These collaborations enrich the innovative processes within the company, leading to groundbreaking developments in semiconductor technologies.

Conclusion

Ebin Liao's contributions to semiconductor technology through his innovative patents are shaping the future of the industry. With his extensive knowledge and collaboration with talented professionals, he plays a vital role in enhancing the functionality and performance of semiconductor components, making him a key figure in the field of innovation.

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