The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Aug. 23, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/146 (2006.01); B30B 5/02 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); B29C 66/81455 (2013.01); B30B 5/02 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83894 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A bonding apparatus includes a chuck and a bonding head. The chuck is configured to carry a plurality of substrates to be bonded. The bonding head has a cavity facing the chuck and includes a divider, at least one pneumatic component and a diaphragm. The divider is disposed in the cavity and dividing the cavity into a plurality of compartments. The at least one pneumatic component is disposed in at least one of the compartments. The diaphragm covers the cavity and is disposed between the at least one pneumatic component and the chuck.