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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10672737 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Jan. 19, 2018

Three-dimensional integrated circuit structure and method of manufacturing the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Hsiu Chen, Hsinchu, TW;

Ebin Liao, Hsin-Chu, TW;

Hong-Ye Shih, New Taipei, TW;

Wen-Chih Chiou, Miaoli County, TW;

Jia-Ling Ko, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/544 (2006.01); H01L 21/822 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 21/8221 (2013.01); H01L 23/544 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06582 (2013.01);
Abstract

Provided is a 3DIC structure includes a wafer, a die and a dielectric layer. The die is over and bonded to the wafer. The dielectric layer is over the wafer and aside the die, covering sidewalls of the die. A total thickness variation (TTV) of the die is less than 0.8 μm.

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Chen, Yi-Hsiu. (2020). Three-dimensional integrated circuit structure and method of manufacturing the same (U.S. Patent No. 10672737). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10672737

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