IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Hong-Ye Shih

USPTO Granted Patents = 12

Average Co-Inventor Count = 7.8

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Taipei, TW (2016)
  • New Taipei, TW (2017 - 2024)

Company Filing History:

goldMedal12 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

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12 patents (USPTO):Explore Patents
1. 12322680 - Semiconductor device having backside interconnect structure on through substrate via (2025-06-03),
2. 12051672 - Package structure and method of forming the same (2024-07-30),
3. 11823979 - Method of forming semiconductor device having backside interconnect structure on through substrate via (2023-11-21),
4. 11056419 - Semiconductor device having backside interconnect structure on through substrate via and method of forming the same (2021-07-06),
5. 11004741 - Profile of through via protrusion in 3DIC interconnect (2021-05-11),
6. 10672737 - Three-dimensional integrated circuit structure and method of manufacturing the same (2020-06-02),
7. 10566237 - Profile of through via protrusion in 3DIC interconnect (2020-02-18),
8. 10510641 - Semiconductor device having backside interconnect structure on through substrate via and method of forming the same (2019-12-17),
9. 10163705 - Profile of through via protrusion in 3DIC interconnect (2018-12-25),
10. 10074595 - Self-alignment for redistribution layer (2018-09-11),
11. 9786580 - Self-alignment for redistribution layer (2017-10-10),
12. 9449898 - Semiconductor device having backside interconnect structure through substrate via and method of forming the same (2016-09-20),

Title: The Innovative Journey of Inventor Hong-Ye Shih

Introduction

Hong-Ye Shih is a notable inventor based in New Taipei, Taiwan. With a remarkable portfolio of 12 patents, his contributions to the field of semiconductor technology have significantly advanced modern electronics. Shih's expertise in creating efficient and effective solutions within this domain has earned him recognition among his peers and within the industry.

Latest Patents

Among his latest innovations, Shih has developed a semiconductor device featuring a backside interconnect structure on a through-substrate via. This groundbreaking device incorporates a unique design with a concave or convex portion adjacent to the backside of the semiconductor substrate. An isolation film is established on the backside, while a conductive layer is strategically placed over the structure. Additionally, Shih has created a patent for a package structure methodology that involves bonding a die to a wafer. This method enhances the overall performance by reducing the total thickness variation of the die after a meticulous thinning process.

Career Highlights

Currently, Shih is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading entity in the semiconductor manufacturing space. His career is marked by significant technological contributions that have paved the way for advancements in chip design and manufacturing processes.

Collaborations

Throughout his career, Shih has collaborated with distinguished colleagues, including Wen-Chih Chiou and Ming-Tsu Chung. These partnerships have fostered a productive environment, enabling the development of innovative solutions in the semiconductor field.

Conclusion

In conclusion, Hong-Ye Shih's inventiveness and dedication to the semiconductor industry are evident through his numerous patents and collaborative efforts. His ongoing work and innovations continue to shape the future of technology, making him an invaluable asset in the quest for advancement in the field.

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