Jia-Ling Ko

Title: Jia-Ling Ko: Innovator in Semiconductor Packaging

Introduction

Jia-Ling Ko is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and performance of integrated circuits.

Latest Patents

Jia-Ling Ko's latest patents include a package structure and method of forming the same. This patent discloses a method that involves bonding a die to a wafer, performing a thinning process on the die, and forming a dielectric layer to cover the die's sidewalls and top surface. The process includes a first removal step to expose the die's top surface and a second removal step to achieve a total thickness variation (TTV) that is less than the initial TTV.

Another notable patent is for a three-dimensional integrated circuit (3DIC) structure and method of manufacturing the same. This invention features a wafer, a die, and a dielectric layer that covers the die's sidewalls. The TTV of the die is maintained at less than 0.8 μm, showcasing the precision of his work.

Career Highlights

Jia-Ling Ko is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in packaging technology has positioned him as a key player in advancing semiconductor manufacturing processes.

Collaborations

Throughout his career, Jia-Ling Ko has collaborated with talented individuals such as Yi-Hsiu Chen and Ebin Liao. These partnerships have contributed to the successful development of innovative technologies in the semiconductor field.

Conclusion

Jia-Ling Ko's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in integrated circuit technology.