Seongnam-si, South Korea

Dong Soo Ryu

USPTO Granted Patents = 10 

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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10 patents (USPTO):Explore Patents

Title: The Innovations of Dong Soo Ryu: A Pioneer in Semiconductor Technology

Introduction

Dong Soo Ryu, an accomplished inventor based in Seongnam-si, South Korea, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of eight patents, his innovations focus on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

Among his latest inventions, Ryu has developed a semiconductor package and a fabricating method that facilitates the creation of complex three-dimensional structures. This patent outlines various semiconductor package structures, including configurations for interposers, interlayers, and heat dissipaters. These innovations aim to reduce costs, increase manufacturability, and improve the reliability of semiconductor devices.

Another notable patent of Ryu’s is a system and method for laser-assisted bonding of electronic devices. This innovation introduces systems and methods that enhance the control of laser irradiation on semiconductor dies. By improving the spatial and temporal aspects of the laser application, this invention significantly optimizes the bonding process between semiconductor dies and their substrates.

Career Highlights

Dong Soo Ryu has held positions in prominent companies, including Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His tenure at these corporations has provided him with valuable experience and insights into the semiconductor industry, allowing him to drive important innovations forward.

Collaborations

Throughout his career, Ryu has collaborated with notable colleagues, including Keun Soo Kim and Jae Yun Kim. These partnerships have fostered a collaborative environment that has led to groundbreaking advancements in semiconductor technologies.

Conclusion

Dong Soo Ryu's pioneering work in semiconductor packaging and laser-assisted bonding methods underscores his influence as a leading inventor in this field. His commitment to enhancing semiconductor technologies has not only contributed to industry advancements but also paved the way for continued innovation in electronics. As the semiconductor landscape evolves, the contributions of inventors like Ryu will remain pivotal in shaping the future of technology.

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