The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Apr. 23, 2015
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Keun Soo Kim, Yongin-si, KR;
Jae Yun Kim, Namyangju-si, KR;
Byoung Jun Ahn, Seongnam-si, KR;
Dong Soo Ryu, Seongnam-si, KR;
Dae Byoung Kang, Seoul, KR;
Chel Woo Park, Seoul, KR;
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49894 (2013.01); H01L 23/3121 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 25/105 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92225 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.