This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc.. Active years: 2018-2025.
Company Filing History:
3 out of 329 
2 out of 1,009 
Years Active: 2018-2025
Title: Byoung Jun Ahn: Innovator in Semiconductor Technology
Introduction
Byoung Jun Ahn is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative semiconductor package structures and methods that enhance manufacturability and reliability.
Latest Patents
One of his latest patents is a semiconductor package and fabricating method that involves a semiconductor device structure, specifically a 3D structure. This patent outlines various semiconductor package structures and manufacturing methods that incorporate interposer, interlayer, and heat dissipater configurations. These innovations aim to provide low-cost solutions while increasing manufacturability and ensuring high reliability.
Career Highlights
Throughout his career, Byoung Jun Ahn has worked with notable companies in the semiconductor industry, including Amkor Technology Singapore Holding Pte. Ltd. and Amkor Technology, Inc. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor packaging.
Collaborations
Byoung Jun Ahn has collaborated with several professionals in his field, including Keun Soo Kim and Jae Yun Kim. These collaborations have contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Byoung Jun Ahn is a key figure in the semiconductor industry, known for his innovative patents and contributions to semiconductor packaging. His work continues to influence the field, paving the way for future advancements in technology.