The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Aug. 27, 2020
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Inventors:
Tae Ho Yoon, Daejeon, KR;
Yang Gyoo Jung, Seoul, KR;
Min Ho Kim, Seoul, KR;
Youn Seok Song, Gwangju, KR;
Dong Soo Ryu, Seongnam-si, KR;
Choong Hoe Kim, Seoul, KR;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); G02B 27/09 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); G02B 27/0927 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 23/3128 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2021/60112 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.