Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Dong Soo Ryu

Min Ho Kim

Keun Soo Kim

Jae Yun Kim

Dae Byoung Kang

Chel Woo Park

Choong Hoe Kim

Yang Gyoo Jung

Tae Ho Yoon

Byoung Jun Ahn

Youn Seok Song

A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Semiconductor package and fabricating method thereof

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Laser-assisted bonding apparatus for bonding an electronic device to a substrate

System and method for laser assisted bonding of an electronic device

System and method for laser assisted bonding of semiconductor die

Growing community of inventors

Seongnam-si, South Korea

Dong Soo Ryu