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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12374558 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Aug. 28, 2023

Laser-assisted bonding apparatus for bonding an electronic device to a substrate

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Tae Ho Yoon, Daejeon, KR;

Yang Gyoo Jung, Seoul, KR;

Min Ho Kim, Seoul, KR;

Youn Seok Song, Gwangju, KR;

Dong Soo Ryu, Seongnam-si, KR;

Choong Hoe Kim, Seoul, KR;

Assignee:

Amkor Technology Singapore Holding Ptd. Ltd., Singapore, SG;

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Norman D Richards

Assistant Examiner:

Laura M Dykes

Int. Cl.
CPC ...
H01L 21/48 (2006.01); G02B 27/00 (2006.01); G02B 27/01 (2006.01); G02B 27/09 (2006.01); G06F 3/01 (2006.01); G06F 3/033 (2013.01); G09G 5/377 (2006.01); G09G 5/38 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); G02B 27/0093 (2013.01); G02B 27/0172 (2013.01); G02B 27/0927 (2013.01); G06F 3/012 (2013.01); G06F 3/033 (2013.01); G09G 5/377 (2013.01); G09G 5/38 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); G02B 2027/0138 (2013.01); G02B 2027/014 (2013.01); G09G 2320/106 (2013.01); G09G 2354/00 (2013.01); H01L 2021/60112 (2013.01); H01L 23/3128 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Find Patent Forward Citations

Yoon, Tae. (2025). Laser-assisted bonding apparatus for bonding an electronic device to a substrate (U.S. Patent No. 12374558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12374558

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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