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For the Inventor, By the Inventor

Milpitas, CA, United States of America

David W Shortt

USPTO Granted Patents = 34 

Average Co-Inventor Count = 3.2

ph-index = 11

Forward Citations = 355(Granted Patents)


Location History:

  • Christmas, FL (US) (2011)
  • Milpitas, CA (US) (2002 - 2017)
  • Los Gatos, CA (US) (2015 - 2020)

Company Filing History:

goldMedal17 out of 641 
 
Kla-tencor Technologies Corporation
 patents
silverMedal16 out of 1,787 
 
Kla Tencor Corporation
 patents
bronzeMedal1 out of 832,680 
Other
 patents

Years Active: 2002-2020

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34 patents (USPTO):
1. 10571407 - Determining information for defects on wafers (2020-02-25),
2. 10317347 - Determining information for defects on wafers (2019-06-11),
3. 10082470 - Defect marking for semiconductor wafer inspection (2018-09-25),
4. 9891177 - TDI sensor in a darkfield system (2018-02-13),
5. 9887076 - Method and system for controlling convective flow in a light-sustained plasma (2018-02-06),
6. 9846930 - Detecting defects on a wafer using defect-specific and multi-channel information (2017-12-19),
7. 9558858 - System and method for imaging a sample with a laser sustained plasma illumination output (2017-01-31),
8. 9552636 - Detecting defects on a wafer using defect-specific and multi-channel information (2017-01-24),
9. 9390902 - Method and system for controlling convective flow in a light-sustained plasma (2016-07-12),
10. 9297769 - Method for reducing aliasing in TDI based imaging (2016-03-29),
11. 9092846 - Detecting defects on a wafer using defect-specific and multi-channel information (2015-07-28),
12. 8947521 - Method for reducing aliasing in TDI based imaging (2015-02-03),
13. 8582094 - Systems and methods for inspecting specimens including specimens that have a substantially rough uppermost layer (2013-11-12),
14. 8060962 - Taping knife with hammer (2011-11-22),
15. 7796805 - Defect detection (2010-09-14),

Title: David W Shortt: Innovator in Wafer Technologies

Introduction

David W Shortt is a notable inventor based in Milpitas, California, with a remarkable portfolio comprising 33 patents. His work primarily focuses on innovations that enhance the accuracy and efficiency of wafer defect detection, contributing significantly to the semiconductor manufacturing industry.

Latest Patents

One of Shortt's latest patents is centered around systems and methods for determining information for defects on wafers. The innovative system outlined in the patent includes an illumination subsystem that directs light with specific wavelengths to the wafer, triggering fluorescence from certain materials while preventing other materials from fluorescing. The detection subsystem captures only the relevant fluorescence or non-fluorescent light, and the computer subsystem processes this information to assess defects on the wafer effectively.

Career Highlights

Throughout his career, David W Shortt has held pivotal roles at Kla-Tencor Technologies Corporation and Kla Tencor Corporation. His engineering expertise and pioneering inventions have played a significant role in advancing wafer inspection technologies, helping improve quality control in semiconductor fabrication processes.

Collaborations

During his professional journey, Shortt has collaborated with distinguished colleagues, including Christopher F Bevis and George J Kren. These partnerships have facilitated the sharing of ideas and expertise, furthering innovation within the industry.

Conclusion

David W Shortt's contributions to the field of wafer technology and defect detection epitomize the spirit of innovation. With numerous patents to his name, he continues to influence the semiconductor industry, driving advancements that enhance manufacturing precision and efficiency.

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